Gluing chips together copper-to-copper (hybrid bonding)
Stage 3 Β· Factories & orders
On Oct 26, 2026 Applied Materials agreed to raise its stake in Besi to about 20%. When the world's biggest chip-tool maker buys a big piece of a small bonding specialist, it is betting that chip 'welding' goes mainstream.
π± First issue β history starts today. Change arrows, βmoved upβ alerts and day-over-day markers appear automatically once the next daily issue is published.
π New todayReadiness vs prev: history starts today Β· Updated 2026-10-28
Stage 2 Β· PrototypeOptical compute
1. Computing with light instead of electricity (optical AI chip)
π Neurophos (US startup) + MIT CSAIL Julia Lab Β· π Patent US11843182B2 granted 2023-12-12 (filed 2021-09-13); MIT collab 2026
What they found: A startup is building chips that do AI math with light passing through tiny 'metamaterial' patterns, and is working with MIT on the software to run them.
π§ Like I'm 10: Some computers might one day think with flashlight beams instead of electricity, so they stay cool and fast.
Neurophos holds granted US and international patents on its optical design. Other optical-compute firms (e.g. Lightmatter) hold their own patents, so overlap disputes are possible. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π° So what for investors: Companies tied to this: Tower Semiconductor. Proof is building; watch for customer orders. (our judgment, not advice)
π Bull case
A startup is building chips that do AI math with light passing through tiny 'metamaterial' patterns, and is working with MIT on the software to run them.
Who could win: Neurophos (private, US), GlobalFoundries GFS (US, photonics foundry), Tower Semiconductor TSEM (Israel)
π» What could go wrong
Nature Photonics review (2026): in the cloud, losses and light-to-electric conversions 'dominate power' and have so far prevented commercial photonic tensor cores. source
SPIE paper: data converters can be over 80% of the conversion power budget in photonic AI accelerators. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
2/5 β Working prototype chip
55%
13.8
Manufacturability
2/5
20%
8.0
Supply chain
1/5
10%
2.0
Corporate backing
2/5
10%
4.0
Independent groups
3/5
5%
3.0
Readiness
31/100
Hype = 10Γclaim boldness (4/5) + 10Γattention (4/5) = 80. Patent/IP risk: Medium (crowding 4/5, litigation 2/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 25 β 31, hype 80 β 80, years 4-6 β 3-6.
π What to watch next: First chip samples to customers and any foundry partnership announcement.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Lab demos and first test chips
π Executive briefing teaser free
Optical AI compute is still pre-revenue but backed by granted IP and an MIT software partnership.
Optical AI compute is still pre-revenue but backed by granted IP and an MIT software partnership. Watch for tape-out news; foundries with photonics lines are the picks-and-shovels play.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
What if your AI chip ran on light? A US startup called Neurophos is doing AI math by shining light through microscopic patterns. Less heat, more speed. It's early: no product yet. But they hold patents and just teamed up with MIT. If it works, photonics foundries win first. Source links on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
What they found: Volantis revealed a plan to build optical connections into the base layer (interposer) that sits under an AI chip and its memory, so data moves by light.
π§ Like I'm 10: Chips wait for memory like kids waiting in a lunch line. This idea builds a super-fast light slide to bring the food.
Volantis has filed patents (see assignee profile). Big players like Nvidia, Broadcom and Ayar Labs hold large optical I/O portfolios, so licensing may be needed. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
Volantis (private)Coherent COHR (US)Lumentum LITE (US)STMicro STM (EU)
π° So what for investors: Companies tied to this: Coherent. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
Volantis revealed a plan to build optical connections into the base layer (interposer) that sits under an AI chip and its memory, so data moves by light.
Who could win: Volantis (private), Coherent COHR (US), Lumentum LITE (US)
π» What could go wrong
Nvidia networking SVP: 'If you can use copper, use copper' β optics only where distance forces it. source
SemiAnalysis: Nvidia is going to 'extreme lengths' to stay on copper for scale-up through 2027-2028; limited first-wave CPO adoption expected. source
Plan revealed, no shipping product disclosed yet (our reading of the source). (judgment)
π How we scored this
Criterion
Score
Weight
Points
Evidence level
1/5 β Lab demo
55%
5.5
Manufacturability
3/5
20%
12.0
Supply chain
3/5
10%
6.0
Corporate backing
2/5
10%
4.0
Independent groups
4/5
5%
4.0
Readiness
32/100
Hype = 10Γclaim boldness (4/5) + 10Γattention (4/5) = 80. Patent/IP risk: Medium (crowding 4/5, litigation 2/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 20 β 32, hype 75 β 80, years 4-7 β 4-8.
π What to watch next: Prototype demo data and named customer pilots.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Prototype shown to partners
π Executive briefing teaser free
Early-stage photonic interposer aimed at the 'memory wall'.
Early-stage photonic interposer aimed at the 'memory wall'. High upside, high execution risk; laser and photonics suppliers benefit regardless of which startup wins.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
AI chips are starving, waiting for data from memory. Volantis wants to fix that with light: an optical highway built right under the chip. It's just a plan for now. But if it works, laser makers like Coherent and Lumentum get a new market. Links on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π New todayReadiness vs prev: history starts today Β· Updated 2026-10-28
Stage 1 Β· PaperIn-memory / analog compute
3. Storing many values in one memory spot (superposed analog memory)
π IBM Research Β· π 2026-10 (arXiv 2610.26118); patent app US 2026/0291719
What they found: Researchers showed a way to pack several pieces of information into the same analog memory cell and still read them back, cutting memory needed for AI search.
π§ Like I'm 10: Imagine one drawer that magically holds three toys at once, and you can still pick each one out.
IBM has both the paper and a matching patent application plus older granted patents: strong IP wall. Anyone copying the method may need a licence. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
IBM (US)Micron MU (US)Weebit Nano WBT (Australia, small)
π° So what for investors: Companies tied to this: Micron. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
Researchers showed a way to pack several pieces of information into the same analog memory cell and still read them back, cutting memory needed for AI search.
Who could win: IBM (US), Micron MU (US), Weebit Nano WBT (Australia, small)
π» What could go wrong
System-level review: specialised analog/physical accelerators can show 'little or no advantage' once conversion, control and memory access are counted. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
0/5 β Paper / simulation only
55%
0.0
Manufacturability
2/5
20%
8.0
Supply chain
2/5
10%
4.0
Corporate backing
3/5
10%
6.0
Independent groups
1/5
5%
1.0
Readiness
19/100
Hype = 10Γclaim boldness (2/5) + 10Γattention (2/5) = 40. Patent/IP risk: Medium (crowding 3/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 15 β 19, hype 40 β 40, years 5-8 β 6-10.
π What to watch next: Chip-level demo on IBM's analog AI hardware.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: More papers and patents
π Executive briefing teaser free
IBM is pairing research with patent filings, signalling commercial intent.
IBM is pairing research with patent filings, signalling commercial intent. Long-dated; relevant to memory makers and analog-AI specialists.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Imagine one memory cell holding several numbers at once. IBM just published that trick, and filed a patent on it the same season. That's a signal they plan to use it. It's years away, but memory makers should pay attention. Sources on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
Splitting/redundancy ideas are widely published; patent risk looks moderate. Micron may file follow-ups. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
Micron MU (US, India plant in Gujarat)Kaynes KAYNES.NS (India, OSAT partner ecosystem)
π° So what for investors: Companies tied to this: Micron, Kaynes Technology. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
Micron showed that splitting each AI 'weight' across several memory cells averages out the errors that make analog chips unreliable.
Who could win: Micron MU (US, India plant in Gujarat), Kaynes KAYNES.NS (India, OSAT partner ecosystem)
π» What could go wrong
System-level review: specialised analog/physical accelerators can show 'little or no advantage' once conversion, control and memory access are counted. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
0/5 β Paper / simulation only
55%
0.0
Manufacturability
4/5
20%
16.0
Supply chain
4/5
10%
8.0
Corporate backing
4/5
10%
8.0
Independent groups
3/5
5%
3.0
Readiness
35/100
Hype = 10Γclaim boldness (1/5) + 10Γattention (2/5) = 30. Patent/IP risk: Low (crowding 2/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 30 β 35, hype 30 β 30, years 3-5 β 4-8.
π What to watch next: Whether Micron shows it on real silicon or in a product roadmap.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Follow-up papers
π Executive briefing teaser free
A memory giant publishing fixes for analog AI errors suggests in-memory compute is moving toward products.
A memory giant publishing fixes for analog AI errors suggests in-memory compute is moving toward products. Micron is the direct beneficiary.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Analog AI chips are super efficient but sloppy. Micron found a simple fix: spread each number across several cells, like averaging friends' guesses. When a memory giant solves accuracy, products tend to follow. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π° So what for investors: Companies tied to this: Coherent, Tower Semiconductor, Nvidia. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
A tiny silicon 'slow-light' modulator flips light on and off fast enough to carry 200 Gb/s on a single colour of laser.
Who could win: Marvell MRVL (US), Broadcom AVGO (US), Coherent COHR (US)
π» What could go wrong
Nvidia networking SVP: 'If you can use copper, use copper' β optics only where distance forces it. source
SemiAnalysis: Nvidia is going to 'extreme lengths' to stay on copper for scale-up through 2027-2028; limited first-wave CPO adoption expected. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
1/5 β Lab demo
55%
5.5
Manufacturability
4/5
20%
16.0
Supply chain
4/5
10%
8.0
Corporate backing
1/5
10%
2.0
Independent groups
4/5
5%
4.0
Readiness
36/100
Hype = 10Γclaim boldness (3/5) + 10Γattention (1/5) = 40. Patent/IP risk: Medium (crowding 3/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 35 β 36, hype 45 β 40, years 3-5 β 2-6.
π What to watch next: Adoption in 1.6T/3.2T optical transceiver roadmaps.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: More lab records
π Executive briefing teaser free
Next-gen per-lane speed is a key spec for data-centre optics.
Next-gen per-lane speed is a key spec for data-centre optics. Lab result today, but it maps directly onto transceiver vendors' roadmaps.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Data centres talk with light. A new chip-sized switch flips light 200 billion times a second on one colour. Faster switches mean cheaper, cooler AI clusters. Optics makers like Marvell and Coherent are the ones to watch. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
What they found: imec tested whether transistors made of atom-thin materials and stacked in pairs beat silicon at the ~2026+ 'A2' node. Honest answer: not yet. Contacts and wiring losses eat the gains.
π§ Like I'm 10: Making transistors from sheets just one atom thick and stacking them like pancakes.
CFET structures are heavily patented by TSMC, Intel, Samsung and IBM. Any newcomer faces dense IP. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
ASML (EU)Applied Materials AMAT (US)Lam Research LRCX (US)Aixtron AIXA (EU, 2D-material tools)
π° So what for investors: Companies tied to this: Aixtron. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
imec tested whether transistors made of atom-thin materials and stacked in pairs beat silicon at the ~2026+ 'A2' node.
Who could win: ASML (EU), Applied Materials AMAT (US), Lam Research LRCX (US)
π» What could go wrong
No fab today grows 2D-material layers at wafer scale with chip-grade yield (our judgment; no single source). (judgment)
π How we scored this
Criterion
Score
Weight
Points
Evidence level
1/5 β Lab demo
55%
5.5
Manufacturability
0/5
20%
0.0
Supply chain
1/5
10%
2.0
Corporate backing
3/5
10%
6.0
Independent groups
3/5
5%
3.0
Readiness
16/100
Hype = 10Γclaim boldness (3/5) + 10Γattention (2/5) = 50. Patent/IP risk: Medium (crowding 3/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 10 β 16, hype 55 β 50, years 8+ β 6-10.
π What to watch next: imec/foundry papers at IEDM (December) on contact resistance fixes.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: More lab tests on contacts
π Executive briefing teaser free
A sober reality-check paper: 2D CFETs are a 2030s story.
A sober reality-check paper: 2D CFETs are a 2030s story. The tool makers win either way because every new transistor needs new deposition and etch.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Chips are running out of room, so engineers want to stack transistors made of material just one atom thick. Europe's top chip lab, imec, tested it, and says: not yet. That honesty is useful. The safe winners? The toolmakers. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π New todayReadiness vs prev: history starts today Β· Updated 2026-10-28
Stage 3 Β· Factories & ordersChiplets / packaging
7. Gluing chips together copper-to-copper (hybrid bonding)
π Applied Materials + Besi; SK hynix Β· π 2026-10-01 partnership; 2026-10-26 Applied raises Besi stake to ~20%
What they found: Tool makers are teaming up to sell machines that fuse chips directly, copper pad to copper pad. But SK hynix says it won't be ready for the next memory generation (HBM4E).
π§ Like I'm 10: Instead of using tiny solder balls, chips are pressed together so their copper parts fuse, like welding.
Besi/Applied, Adeia (licensor, ADEA) and TSMC hold key hybrid-bonding patents. Adeia actively licenses: a royalty stream, and a lawsuit risk for others. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
Besi BESI.AS (EU)Applied Materials AMAT (US)Adeia ADEA (US, small, IP licensor)Hanmi Semiconductor 042700.KS (Korea)
π° So what for investors: Companies tied to this: Besi, Advantest, CG Power, Adeia. Orders and factories exist; this can show up in results within ~2 years. (our judgment, not advice)
π Bull case
Tool makers are teaming up to sell machines that fuse chips directly, copper pad to copper pad.
Who could win: Besi BESI.AS (EU), Applied Materials AMAT (US), Adeia ADEA (US, small, IP licensor)
π» What could go wrong
SK hynix says hybrid bonding won't be ready for HBM4E memory stacks. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
4/5 β Volume production or orders
55%
41.2
Manufacturability
4/5
20%
16.0
Supply chain
4/5
10%
8.0
Corporate backing
5/5
10%
10.0
Independent groups
5/5
5%
5.0
Readiness
80/100
Hype = 10Γclaim boldness (2/5) + 10Γattention (3/5) = 50. Patent/IP risk: High (crowding 4/5, litigation 4/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 65 β 80, hype 50 β 50, years 1-3 β 0-2.
π What to watch next: Which memory generation (HBM5?) adopts it; Besi order intake.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: More orders for bonding machines
π Executive briefing teaser free
Hybrid bonding is at the orders stage.
Hybrid bonding is at the orders stage. Timing slipped for HBM4E, which favours legacy bonder makers short-term and Besi/AMAT longer-term. Adeia is an under-the-radar IP play.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Next-gen AI chips are glued together atom-close using copper. Toolmakers Applied Materials and Besi are teaming up to sell the machines. But memory giant SK hynix says it's not ready yet. Delay now, big wave later. Links on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π° So what for investors: Companies tied to this: Ibiden, Tata Electronics fab, Corning, TSMC. Proof is building; watch for customer orders. (our judgment, not advice)
π Bull case
Several firms are testing glass as the base board under giant AI chips because it stays flat and lets wires sit closer together.
Who could win: Ibiden 4062.T (Japan), Samsung Electro-Mechanics 009150.KS (Korea), SKC 011790.KS (Korea)
π» What could go wrong
Tom's Hardware: glass-core substrates are 'still not in a single commercial product' and every timeline has slipped. source
TrendForce/The Elec: Samsung Electro-Mechanics order schedule pushed back at least 3 times; mass production possibly 2028+ (company disputes a failed qualification). source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
3/5 β Customer samples / qualification
55%
24.8
Manufacturability
2/5
20%
8.0
Supply chain
2/5
10%
4.0
Corporate backing
5/5
10%
10.0
Independent groups
5/5
5%
5.0
Readiness
52/100
Hype = 10Γclaim boldness (3/5) + 10Γattention (4/5) = 70. Patent/IP risk: Medium (crowding 3/5, litigation 2/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 40 β 52, hype 65 β 70, years 2-4 β 2-4.
π What to watch next: Pilot-line yields and first AI product using a glass core.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Pilot lines and samples
π Executive briefing teaser free
Glass substrates are moving from lab to pilot lines.
Glass substrates are moving from lab to pilot lines. Substrate makers and glass specialists are positioned; India gets a foothold via 3DGS's Odisha project.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
The board under an AI chip may soon be made of glass. It stays flat and fits more wires. TSMC is testing it with Japan's Ibiden; Samsung and BOE are racing too. Even India has a glass-packaging plant coming. Links on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π New todayReadiness vs prev: history starts today Β· Updated 2026-10-28
Stage 1 Β· PaperNeuromorphic
9. Brain-like chip that can learn on the device (neuromorphic)
π Academic team in China (see author list) Β· π 2026-03-25 (Nature Communications)
What they found: A brain-style chip design that can train itself directly, demonstrated on FPGA, beating Nvidia's Jetson Orin 1.9-3.3x and using far less memory traffic than an A100 in training.
π§ Like I'm 10: A chip that works like a tiny brain and can learn new things by itself, without the cloud.
π° So what for investors: Companies tied to this: BrainChip, AMD. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
A brain-style chip design that can train itself directly, demonstrated on FPGA, beating Nvidia's Jetson Orin 1.9-3.3x and using far less memory traffic than an A100 in training.
Who could win: BrainChip BRN.AX (Australia, small), Lattice LSCC (US, FPGAs), AMD (Xilinx FPGAs)
π» What could go wrong
BrainChip, a listed neuromorphic pioneer, reported only US$1.22M revenue and a US$12.0M loss for H1 2026 β commercial demand for brain-like chips is still tiny. source
System-level review: specialised analog/physical accelerators can show 'little or no advantage' once conversion, control and memory access are counted. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
1/5 β Lab demo
55%
5.5
Manufacturability
3/5
20%
12.0
Supply chain
2/5
10%
4.0
Corporate backing
1/5
10%
2.0
Independent groups
4/5
5%
4.0
Readiness
28/100
Hype = 10Γclaim boldness (3/5) + 10Γattention (3/5) = 60. Patent/IP risk: Low (crowding 2/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 25 β 28, hype 60 β 60, years 4-6 β 4-8.
π What to watch next: Tape-out on real silicon and edge-device partners.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: More FPGA demos
π Executive briefing teaser free
On-device learning for edge AI is a real gap.
On-device learning for edge AI is a real gap. FPGA demo today; small-cap neuromorphic and FPGA vendors are the exposure.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Most AI learns in giant data centres. This brain-like chip learns on the spot, and it beat Nvidia's Jetson by up to 3 times in tests. It's an FPGA demo, not a product. Watch small players like BrainChip. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π New todayReadiness vs prev: history starts today Β· Updated 2026-10-28
Stage 1 Β· PaperNeuromorphic / 2D materials
10. One transistor that can be logic, memory or neuron
π National University of Singapore-led team Β· π 2026-09-14 (Nature Electronics)
What they found: A shape-shifting atom-thin transistor that can be reassigned to act as logic, a synapse or a neuron, filtering out useless data before the 'brain' part wastes energy on it.
π§ Like I'm 10: One tiny switch that can change jobs: sometimes a calculator, sometimes a brain cell.
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
Ferroelectric Memory Co (private, Germany)GlobalFoundries GFS (US)
π° So what for investors: No listed company is directly tied yet. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
A shape-shifting atom-thin transistor that can be reassigned to act as logic, a synapse or a neuron, filtering out useless data before the 'brain' part wastes energy on it.
Who could win: Ferroelectric Memory Co (private, Germany), GlobalFoundries GFS (US)
π» What could go wrong
BrainChip, a listed neuromorphic pioneer, reported only US$1.22M revenue and a US$12.0M loss for H1 2026 β commercial demand for brain-like chips is still tiny. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
1/5 β Lab demo
55%
5.5
Manufacturability
1/5
20%
4.0
Supply chain
1/5
10%
2.0
Corporate backing
1/5
10%
2.0
Independent groups
2/5
5%
2.0
Readiness
16/100
Hype = 10Γclaim boldness (2/5) + 10Γattention (1/5) = 30. Patent/IP risk: Low (crowding 2/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 10 β 16, hype 35 β 30, years 7+ β 6-10.
π What to watch next: Wafer-scale fabrication results.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Bigger arrays in labs
π Executive briefing teaser free
Pure research; tracks a promising direction (reconfigurable, back-end-compatible devices).
Pure research; tracks a promising direction (reconfigurable, back-end-compatible devices). No investable pure play yet.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
What if one tiny transistor could switch jobs: logic one moment, brain cell the next? Singapore researchers built exactly that from a material one atom thick. Decade-away science, but it's how the future starts. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π New todayReadiness vs prev: history starts today Β· Updated 2026-10-28
Stage 1 Β· PaperPhotonic neuromorphic
11. Light-powered brain chip: 1,176x faster on vision
π Fudan University-led team (China) Β· π 2026-04-17 (Nature Communications)
What they found: Chip-compatible optical devices that act as both synapse and neuron cut delay 1,176x and energy 239x versus standard designs on vision tasks (in their tests).
π§ Like I'm 10: A brain chip that uses light. In tests it was over a thousand times faster at recognising pictures.
Chinese groups patent heavily; export-control limits could restrict Western use. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
Chinese photonics foundries (not easily investable)Tower TSEM (Israel)
π° So what for investors: No listed company is directly tied yet. Too early for revenue β a watch-list item. (our judgment, not advice)
π Bull case
Chip-compatible optical devices that act as both synapse and neuron cut delay 1,176x and energy 239x versus standard designs on vision tasks (in their tests).
Who could win: Chinese photonics foundries (not easily investable), Tower TSEM (Israel)
π» What could go wrong
Nature Photonics review (2026): in the cloud, losses and light-to-electric conversions 'dominate power' and have so far prevented commercial photonic tensor cores. source
BrainChip, a listed neuromorphic pioneer, reported only US$1.22M revenue and a US$12.0M loss for H1 2026 β commercial demand for brain-like chips is still tiny. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
1/5 β Lab demo
55%
5.5
Manufacturability
1/5
20%
4.0
Supply chain
1/5
10%
2.0
Corporate backing
1/5
10%
2.0
Independent groups
3/5
5%
3.0
Readiness
16/100
Hype = 10Γclaim boldness (5/5) + 10Γattention (2/5) = 70. Patent/IP risk: Medium (crowding 3/5, litigation 1/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 15 β 16, hype 70 β 70, years 5-8 β 6-10.
π What to watch next: Independent replication and larger arrays.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Other labs try to repeat it
π Executive briefing teaser free
Eye-catching lab gains; geopolitics may keep this inside China.
Eye-catching lab gains; geopolitics may keep this inside China. Monitor for replication.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
A Chinese lab says its light-based brain chip is over a thousand times faster on vision tasks. Big claim, lab test. If it holds up, photonics becomes the brain of edge AI. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
What they found: ST says its PIC100 silicon-photonics process entered high-volume production on 300 mm lines for hyperscalers (800G and 1.6T optical links), with plans to more than quadruple capacity by 2027.
π§ Like I'm 10: Chips that talk using light are already being made in big factories right now.
ST licenses/owns its process; competitors (Intel, TSMC COUPE, GlobalFoundries) have their own. Low infringement risk for buyers. (Our judgment)
π Patent risk noteIncluded in Pro & InstitutionalUnlock Premium
π Who could win
STMicro STM (EU)Coherent COHR (US)Lumentum LITE (US)
π° So what for investors: Companies tied to this: Coherent, STMicroelectronics, Nvidia. Orders and factories exist; this can show up in results within ~2 years. (our judgment, not advice)
π Bull case
ST says its PIC100 silicon-photonics process entered high-volume production on 300 mm lines for hyperscalers (800G and 1.6T optical links), with plans to more than quadruple capacity by 2027.
Who could win: STMicro STM (EU), Coherent COHR (US), Lumentum LITE (US)
π» What could go wrong
Nvidia networking SVP: 'If you can use copper, use copper' β optics only where distance forces it. source
SemiAnalysis: Nvidia is going to 'extreme lengths' to stay on copper for scale-up through 2027-2028; limited first-wave CPO adoption expected. source
π How we scored this
Criterion
Score
Weight
Points
Evidence level
4/5 β Volume production or orders
55%
41.2
Manufacturability
5/5
20%
20.0
Supply chain
4/5
10%
8.0
Corporate backing
5/5
10%
10.0
Independent groups
5/5
5%
5.0
Readiness
84/100
Hype = 10Γclaim boldness (1/5) + 10Γattention (2/5) = 30. Patent/IP risk: Medium (crowding 3/5, litigation 2/5). Sub-scores are our judgment from the linked sources. Full method
Re-scored 2026-10-29 with the formula: readiness 75 β 84, hype 25 β 30, years 0-2 β 0-2.
π What to watch next: Named hyperscaler customers and revenue disclosure.
β° Time Machinedrag: 1 β 3 β 5 years (our scenario, not a forecast)
In 1 year: Capacity grows; more customers
π Executive briefing teaser free
The proof point that photonics research becomes revenue: ST is at volume.
The proof point that photonics research becomes revenue: ST is at volume. This is the near-term leg of the optics story.
π Full executive briefingIncluded in Pro & InstitutionalUnlock Premium
π¬ 30-second video script Premium
Remember those light-based chip papers? Here's one that made it: ST now mass-produces silicon photonics for data centres. Paper to profit, in action. Link on our page.
π Video script with citationsIncluded in Pro & InstitutionalUnlock Premium
π‘ Did you know? Patents are often filed months before the paper appears. When a company files a patent and a paper on the same idea (like IBM here), it usually means they plan to sell it.
β± 1 min read
π³ Quick poll: which breakthrough makes money first?
Tap one. Saved only on your device.
β± 1 min read
β³ Countdown to key dates
AMD Q3 2026 results (after US market close)2026-11-03 Β· source
IEDM 2026 begins (San Francisco, Dec 12-16)2026-12-12 Β· source
ISSCC 2027 begins (San Francisco, Feb 14-18)2027-02-14 Β· source
π Plans
Read the radar for free. Teams that act on it early get the full briefings.